– Paʻa kiʻekiʻe me ka paʻakikī o Moh 9 papa
- ʻO ka abrasion kiʻekiʻe a me ka pale kemika
- Hoʻokomo maʻalahi e ka wai epoxy resin glue
- Maʻalahi ka hoʻoponopono ʻana inā hāʻule kekahi tile square
- Loaʻa nā ʻano like ʻole o ka alumina ceramic lining a me ka nui
Huahana | Loihi(mm) | Laulā(mm) | Mānoanoa me ka Dimple(mm) |
Kile Ceramic me 5dimles | 20±0.3 | 20±0.3 | 5/6/7/8/9/10 |
Kile Ceramic me 13 dimples | 20±0.3 | 20±0.3 | 5/6/7/8/9/10 |
Kile Ceramic me 18 dimples | 20±0.3 | 30±0.5 | 5/6/7/8/9/10 |
Kīleʻa Ceramic me 13 dimple | 25±0.4 | 25±0.4 | 5/6/7/8/9/10 |
Hex.Tile | 12 | 3/6/10/11/12/20/24/25 | |
Hex Tile | 19 | 5~25 | |
Hex Tile | 6 | 3~6 | |
Kile huinaha | 20 | 20 | 2~10 |
Kile huinaha | 17.5 | 17.5 | 2~10 |
1) Ka Hui Kemika:
Al2O3 | SiO2 | CaO | MgO | Na2O |
92~93% | 3~6% | 1~1.6% | 0.2-0.8% | 0.1% |
2) Nā waiwai kino:
Kaumaha kiko (g/cc) | >3.60 |
ʻIke ʻia ka porosity (%) | 0 |
Ka Ikaika Hoʻololi (20ºC, Mpa) | 280 |
Ka ikaika compressive (20ºC, Mpa) | 850 |
ʻO ka paʻakikī ʻo Rockwell (HRA) | 80 |
ʻO ka paʻakikī o Vickers (hv) | 1050 |
ʻO ka paʻakikī o Moh (kaulike) | ≥9 |
Hoʻonui wela (20-800ºC, x10-6/ºC) | 8 |
Nui Crystal (μm) | 1.3~3.0 |