– Paʻakiki kiʻekiʻe
- Kūleʻa abrasion kiʻekiʻe
- Ka ʻino a me ka pale kemika
- Ke kaumaha māmā me ka haʻahaʻa haʻahaʻa
- Hiki ke hoʻohana ʻia i nā ʻano ʻano hana abrasion solution āpau
– ʻoihana mining
– ʻoihana sima
– ʻOihana mālama lanahu
– ʻOihana kila
– ʻOihana awa
– Mea kanu mana
1) ʻIkepili kemika:
Al2O3 | SiO2 | CaO | MgO | Na2O |
92~93% | 3~6% | 1~1.6% | 0.2-0.8% | 0.1% |
2) ʻIkepili kino:
Kaumaha kiko (g/cc) | >3.60 |
ʻIke ʻia ka porosity (%) | 0 |
Ka Ikaika Hoʻololi (20ºC, Mpa) | 280 |
Ka ikaika compressive (20ºC, Mpa) | 850 |
ʻO ka paʻakikī ʻo Rockwell (HRA) | 80 |
ʻO ka paʻakikī o Vickers (hv) | 1050 |
ʻO ka paʻakikī o Moh (kaulike) | ≥9 |
Hoʻonui wela (20-800ºC, x10-6/ºC) | 8 |
Nui Crystal (μm) | 1.3~3.0 |