neiye1

99.7% Alumina Wafer Poloka Papa

ʻO ka wehewehe pōkole:

ʻO Chemshun 99.7% Al2O3 Alumina substrate ma ke ʻano he mea maʻemaʻe kiʻekiʻe a me ka nui o nā mea hou, loaʻa iā ia nā waiwai kino maikaʻi a me nā ʻano kemika paʻa, ke kumu kūʻai maikaʻi e hoʻohālikelike ʻia me nā mea ʻē aʻe.Ke hoʻomau mau nei ka alumina maʻemaʻe kiʻekiʻe e ka noiʻi kiʻekiʻe o ka honua a me nā seramika kiʻekiʻe a me nā hale hana seramika maikaʻi.

99.7% Alumina Wafer Polishing Plate no ka Mechanical Polishing.Ma ke ʻano he mea nui o ka CMP chemical mechanical polishing kaʻina.Pono ka CMP no ka hana ʻana i ke kaʻina hana o ka sapphire a me ka Wafer o nā semiconductor.

ʻO Chemshun Ceramics 'maʻemaʻe kiʻekiʻe 99.7% alumina ceramics sapphire polishing a me ka lapping plates, ua hoʻohālikelike ʻia ka disc e like me ke kaʻina hana PIBM.He ʻenehana holomua kūloko kūloko.Hoʻopau maikaʻi ʻo PIBM i ka pilikia nui o ka māwae a me ka deformation o ka nui alumina ceramics. E wehe ka ʻenehana PIBM i kekahi puka aniani o nā seramika maikaʻi.


Huahana Huahana

Palapala noi

E like me ka Alumina ceramic wafer polishing a me ka sapphire lapping disks i hoʻohana ʻia i ka semi-conductive, diamond polishing etc.

Kaʻina hana: ʻO nā ʻano hana a pau o ka Polishing a me ka lapping, e like me CMP chemical mechanical polishing, Mechanical Polishing, Precision Polishing.

Hiʻona

ʻO ka maʻemaʻe kiʻekiʻe a me ka lōʻihi o ke kemika
Kiekie Mechanical ikaika a paakiki
Kū'ē Kū'ē kiʻekiʻe
Pale Voltage Kiʻekiʻe
Kūleʻa ka wela kiʻekiʻe a hiki i 1700ºC
Hana Kū'ē Kū'ē Loa
Hana Hoʻomākaʻikaʻi maikaʻi
ʻO nā ʻano āpau āpau 180,360, 450, 600mm etc

Inoa mea kūʻai 99.7 kiʻekiʻe maʻemaʻe Alumina ceramic Polishing Lapping Discs
Mea waiwai 99.7% alumina
Nui maʻamau D180, 360, 450, 600mm, ʻae ʻia ka nui maʻamau.
kalakala ʻelepani
Palapala noi ʻO Wafer a me Sapphire CMP kaʻina hana i ka ʻoihana semi-conductive
Min.Kauoha 1Pic

ʻIke Kemika / kino

Unite 99.7 Alumina Seramika
Na Waiwai Nui Al2O3 maʻiʻo wt% 99.7-99.9
ʻO ka mānoanoa gm/cc 3.94-3.97
kalakala - ʻelepani
Ka hoʻoheheʻe wai % 0
Na Waiwai Mechanical ʻO ka ikaika hoʻololi (MOR) 20 ºC Mpa(psix10^3) 440-550
Modulus Elastic 20ºC GPa (psix10^6) 375
ʻO Vickers Paʻakikī Gpa(kg/mm2) R45N >=17
Kulou ikaika Gpa 390
Ikaika U'i 25ºC MPa(psix10^3) 248
'O'ole'a Ha'i (KI c) Mpa* m^1/2 4-5
Na Waiwai wela ʻO ka hoʻoili wela (20ºC) W/mk 30
Coefficient o ka hoonui wela (25-1000ºC) 1x 10^-6/ºC 7.6
ʻO ke kū ʻana i ka haʻalulu wela ºC 200
Ka wela hoʻohana kiʻekiʻe ºC 1700
Pono Uila Ka ikaika dielectric (1MHz) ac-kv/mm(ac v/mil) 8.7
Dielectric mau (1 MHz) 25ºC 9.7
Kū'ē Volume ohm-cm (25ºC) >10^14
ohm-cm (500ºC) 2×10^12
ohm-cm (1000ºC) 2×10^7

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